Industrial Aluminum Nitride Pusher Nitrogen Atmosphere Furnace 80kW for TEC Sintering

Precision Bonding for Superior Thermal Management and Electrical Insulation

The Ceramic Clad Copper substrate is the thermal and electrical backbone of a high-performance Thermoelectric Cooler. Its quality dictates the module's power handling capability and longevity. Tailord's Atmosphere Mesh Belt Sintering Furnaces are masterfully engineered for the Direct Bonded Copper (DBC) process, creating a robust, void-free metallurgical bond between oxygen-free copper and ceramic (Al₂O₃ or AlN) through a precisely controlled high-temperature oxidation-sintering cycle. Our furnaces deliver the exceptional atmosphere control and thermal uniformity required to achieve optimal bond strength, minimal thermal resistance, and outstanding dielectric integrity.

Key Applications & Process Advantages for DBC Substrate Sintering:

1. Mastering the Cu-O Eutectic Bonding Mechanism: Our furnaces excel in creating the critical Cu-Cu₂O eutectic liquid phase. The precisely controlled oxygen partial pressure and temperature profile enable this liquid to perfectly wet and react with the ceramic surface, forming a strong chemical bond upon cooling, which is the fundamental principle of the DBC process.

2. Optimized for Aluminum Nitride (AlN) and Alumina (Al₂O₃): Whether sintering on high-thermal-conductivity AlN or cost-effective Al₂O₃, our furnaces provide the tailored atmosphere and thermal profile required. For AlN, a specific nitrogen-oxygen balance is maintained to facilitate bonding without degrading the substrate's intrinsic thermal properties.

3. Exceptional Bond Strength and Peel Resistance: The uniform thermal environment ensures a consistent reaction layer across the entire substrate. This results in superior copper-ceramic adhesion, capable of withstanding severe thermal cycling and mechanical stress without delamination, which is critical for TEC reliability.

4. Minimized Thermal Resistance for Maximum Heat Flux: By creating a void-free, intimate bond between the copper and ceramic, our process minimizes the interfacial thermal resistance. This is paramount for efficient heat extraction from the TEC pellets, directly maximizing the module's cooling power and temperature differential (ΔTmax).

5. Superior Dielectric Strength and Insulation: The process preserves the excellent dielectric properties of the ceramic, ensuring high breakdown voltage and reliable electrical isolation between the copper circuits and the baseplate, which is essential for safe operation in high-power applications.

6. High-Volume Production for Demanding Markets: Designed for continuous 24/7 operation, our Mesh Belt Furnaces enable mass production of DBC substrates for the automotive, telecommunications, and high-power computing industries, where TECs are essential for thermal management.

7. Precise Oxygen Partial Pressure Control: We maintain an exact oxygen concentration (typically a few ppm to tens of ppm) in a predominantly nitrogen atmosphere. This precise control is the key to forming the eutectic without causing excessive oxidation of the copper foil, which would weaken the final bond.

8. Exceptional Temperature Uniformity for Warpage Prevention: With a guaranteed temperature uniformity of ±3°C across the belt, we ensure the entire substrate heats and cools uniformly. This is critical for preventing warpage and residual stress in large-format DBC substrates, which is vital for flatness in TEC assembly.

9. Clean and Contamination-Free Process: The high-purity atmosphere and clean furnace interior prevent the introduction of contaminants that could create weak spots in the bond or lead to electrical failure under high voltage or humidity.

10. Enabling High-Power Density TEC Designs: By providing a reliable and consistent DBC bonding process, our technology empowers the development of next-generation TECs with higher power density and improved performance for cutting-edge applications in laser cooling, medical devices, and electronics test equipment.

Partner with Tailord to build the thermal highway for your most advanced cooling solutions. Our DBC sintering technology provides the foundational substrate that ensures efficient heat transfer, electrical safety, and unwavering reliability in your TEC modules.

• Industrial PC integrated control system
• Ultrasonic mesh belt cleaning system
• Profiling test thermocouple
• Exhaust gas treatment system
• UPS Power Supply
• Industrial chiller