300mm Continuous Belt Metal Sintering Furnace for Hybrid Integrated Circuits HICs 42kW

The Cornerstone of Reliability and Performance in Advanced Electronics

Thick Film Hybrid Integrated Circuits form the backbone of countless critical systems, from automotive control modules to aerospace instrumentation. At the heart of their manufacturing lies the firing process, which transforms printed pastes into robust, functional layers. Tailord's Mesh Belt Sintering Furnaces are precision-engineered to be the production cornerstone for HICs, providing the unparalleled control, consistency, and throughput required to co-fire resistors, conductors, and dielectrics into a monolithic, high-reliability circuit on a ceramic substrate.

Key Applications & Process Advantages for Thick Film HIC Firing:

1. Multi-Layer & Crossover Structure Firing: Excellently suited for sequentially firing complex multi-layer structures. Our furnaces enable the precise firing of a bottom conductor, an overlying dielectric isolation layer, and a top conductor to form reliable crossovers, all with minimal inter-layer diffusion and perfect registration.

2. Precision Resistor Firing with Tight TCR Control: Achieve precise sheet resistivity and exceptionally low Temperature Coefficient of Resistance (TCR) for ruthenium oxide-based resistor pastes. Our multi-zone control allows for fine-tuning the profile to optimize the glass-ceramic matrix, which is critical for achieving stable ±25ppm/°C performance or better.

3. High-Throughput Conductor Formation (Au, Ag, Ag-Pd, Cu): From high-conductivity silver for general interconnects to robust gold for wire bonding and oxidation-resistant copper for high-power applications, our furnaces provide the specific atmosphere (air for Ag, nitrogen for Cu) and thermal profile required for dense, low-resistance, and well-adhered conductor lines.

4. Sealing Glass & Dielectric Layer Firing: Perfect for firing dielectric layers for insulation or encapsulation, and sealing glasses for cavity packages. The controlled profile prevents bubbling, ensures complete densification, and achieves the desired thermal and electrical isolation properties.

5. Superior Substrate Handling for Alumina & AlN: The smooth, continuous belt transport ensures flat, warp-free firing of alumina (Al₂O₃) and high-thermal-conductivity aluminum nitride (AlN) substrates. This is fundamental for maintaining circuit integrity and enabling subsequent fine-pitch assembly processes.

6. Exceptional Process Repeatability for High Yield: The unmatched thermal uniformity (±3°C) and profile repeatability of our furnaces guarantee that every circuit board, from start to end of a production run, is fired identically. This is the foundation for achieving high functional yield and meeting stringent automotive (AEC-Q200) and military standards.

7. Atmosphere Versatility for Advanced Materials: Our furnaces are configurable for various atmospheres, from standard clean air for Ag/Pd pastes to pure nitrogen for copper conductor firing, providing the flexibility to adapt to any thick-film material system.

8. Fine-Line Resolution Preservation: The stable thermal environment and vibration-free transport preserve the sharp edge definition of as-printed fine-line conductors and resistors. This is critical for high-density interconnects and maintaining designed resistor geometry for accurate values post-laser trim.

9. Optimized Laser Trim Stability: A consistently and perfectly fired resistor film provides a stable and predictable response to laser trimming. Our process ensures minimal post-trim drift (∆R/R), which is crucial for achieving final resistance values with accuracies of 0.1% or better.

10. Seamless Integration into Automated Lines: Designed for 24/7 continuous operation, our Mesh Belt Furnaces seamlessly integrate with automated screen printers, inspection systems, and laser trimmers, creating a highly efficient and scalable production cell for high-volume HIC manufacturing.

Partner with Tailord to build your electronic foundations with confidence. Our sintering technology ensures your thick film HICs deliver the performance, density, and reliability that modern systems demand.

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