Continuous Brazing Controlled Atmosphere Furnace 250mm Belt 80kW For Semiconductor

Precision Annealing and Sealing in an Inert Environment for Ultimate Reliability

The integrity of a TO (Transistor Outline) metal-glass package is paramount, protecting sensitive semiconductor chips from the outside world. Tailord's Nitrogen Atmosphere Mesh Belt Furnaces are precision-engineered for the critical processes of glass-to-metal sealing and component annealing. By providing a pristine, oxygen-free environment combined with exceptional thermal control, our furnaces prevent oxidation of metal parts, ensure the formation of a hermetic and stress-free glass seal, and guarantee the long-term stability and reliability required for high-performance discrete devices, optical components, and sensors.

Key Applications & Process Advantages for TO Metal-Glass Packaging:

1. Oxidation-Free Annealing of Metal Parts: The pure nitrogen atmosphere completely prevents oxidation of Kovar, Alloy 42, or copper lead frames and caps during the high-temperature process. This results in pristine, oxide-free metal surfaces that are essential for achieving high-quality subsequent welds or plating.

2. Stress-Relieved Glass-to-Metal Seal Formation: The precise thermal profile allows the glass preform to melt and flow perfectly, wetting the metal components to form a strong, hermetic seal. Controlled heating and cooling rates are critical to minimizing residual thermal stress, which prevents cracking and ensures package integrity under thermal cycling.

3. Hermeticity for Critical Applications: The combination of a perfect seal and a contaminant-free process environment produces packages with superior hermeticity, meeting the stringent leakage rate requirements (e.g., MIL-STD-883) for military, aerospace, and medical implants.

4. Bright Annealing for Superior Surface Quality: Components exit the furnace with a bright, clean finish without any oxide scale, eliminating the need for post-annealing pickling or cleaning steps. This reduces production time, cost, and potential surface damage.

5. High-Volume Production for Semiconductor Industry: Designed for 24/7 continuous operation, our Mesh Belt Furnaces are the engine for mass-producing TO packages for diodes, transistors, ICs, and laser modules, offering unparalleled throughput and consistency.

6. Precise Nitrogen Purity and Flow Control: Our furnace systems feature precise control over nitrogen purity (e.g., 99.999% or higher) and flow dynamics to maintain a consistently low oxygen partial pressure (<10 ppm) throughout the entire heating and cooling zones, ensuring zero oxidation.

7. Exceptional Temperature Uniformity for Seal Consistency: With a guaranteed temperature uniformity of ±3°C across the belt, every package in a batch experiences identical thermal conditions. This uniformity is crucial for achieving consistent glass flow, seal geometry, and mechanical strength across all products.

8. Gentle Handling of Delicate Components: The smooth, continuous motion of the mesh belt transports TO headers and assemblies without jarring or vibration, preventing misalignment of the delicate glass preform and lead pins before and during the sealing process.

9. Controlled Atmosphere Curtains at Entrances/Exits: Advanced gas curtain designs at the furnace inlet and outlet effectively isolate the pure nitrogen environment from the ambient air, minimizing gas consumption while maintaining atmosphere integrity.

10. Enhanced Electrical Performance and Yield: By preventing oxidation on lead frames and ensuring a stress-free seal, our process minimizes potential electrical leakage paths and package-induced stress on the die, leading to higher device performance and production yield.

Partner with Tailord to seal in performance and reliability. Our nitrogen atmosphere sintering solutions provide the foundational technology for TO packages that protect the world's most critical semiconductor devices.

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