Gold Paste Firing SUS310 Belt Continuous Sintering Furnace Metal Heat Treatment 200kW

Where Ultimate Conductivity Meets Unmatched Reliability

In the realm of high-performance and high-reliability electronics, gold paste serves as the conductor of choice where signal integrity, corrosion resistance, and long-term stability are non-negotiable. Tailord's Mesh Belt Furnaces are precision-engineered to transform printed gold paste into a brilliant, dense, and perfectly adhered conductive pathway. Our furnaces deliver the exact thermal management required to burn out organics cleanly and sinter the gold particles into a low-resistance film, without compromising the underlying substrate, making them ideal for the most demanding applications.

Key Applications & Process Advantages for Gold Paste Firing:

1. Hybrid Integrated Circuits (HICs): Achieve flawless interconnections and wire-bonding pads on ceramic substrates. The consistent thermal profile ensures excellent adhesion and a smooth, bondable surface, which is critical for circuit performance and assembly yield.

2. High-Frequency & RF Applications: Gold's superior conductivity and stability are key. Our furnaces prevent surface oxidation and roughness, creating conductors with minimal signal loss at high frequencies, which is essential for RF filters, amplifiers, and aerospace communications.

3. Medical Implants & Sensors: For devices like pacemakers and neural probes, biocompatibility and absolute reliability are paramount. Our clean, controlled sintering process ensures a pure, non-reactive, and highly reliable gold film that meets stringent medical standards.

4. Deep Space & Aerospace Electronics: The non-oxidizing nature of gold is crucial for contacts and interconnects in low-pressure and harsh environments. Our furnaces guarantee a pristine, oxide-free surface that maintains stable electrical properties over decades.

5. Aluminum Nitride (AlN) Substrate Metallization: Excellently suited for firing gold thick-film circuits on high-thermal-conductivity AlN. Our precise temperature control is key to forming a strong interface without reacting with the AlN substrate, which is vital for high-power LED and laser diode packaging.

6. Precise Organic Burn-Out: The multi-zone profile allows for a carefully controlled burnout zone, which completely removes the vehicle and binders without blistering or contaminating the gold layer, which is essential for a pore-free, dense final film.

7. Low-Temperature Cofiring on Sensitive Substrates: Perfect for firing gold on temperature-sensitive materials like certain glass or pre-fired LTCC. Our furnaces can be finely tuned to achieve optimal sintering without softening or damaging the substrate.

8. Superior Wire Bondability: The resulting sintered gold surface is uniform and free of organics and oxides, providing an ideal foundation for high-strength gold wire bonding, which results in robust and reliable interconnections.

9. Exceptional Solderability and Lead Attachment: The sintered gold layer provides an excellent, non-oxidizing surface for soldering, ensuring strong, void-free joints for component attachment, which is critical in power modules and advanced packaging.

10. Maximized Throughput for High-Value Components: While gold is a premium material, our Mesh Belt Furnaces enable efficient, continuous sintering of high-value products, optimizing production flow and protecting your investment by ensuring near-zero defect rates.

Partner with Tailord to gild your critical connections. Our sintering solutions provide the foundation for gold conductors that deliver unmatched performance, longevity, and trust in the world's most advanced electronic systems.